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Veröffentlicht: 2025-02-27 08:21:46.312935 Kategorie: Hobbies and Leisure Typ: Foto Model release: NEIN

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Close view of silicon wafer dicing process shows a high-precision tool cutting silicone wafers into individual chips in a cleanroom environment. This activity is crucial for semiconductor production

Contributor: Albert Kazakh

ID : 1295709335

DateienDrucke und Produkte

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Foto	4630x2595

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