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Veröffentlicht: 2026-06-22 17:54:34.269274 Kategorie: Technology Typ: Foto Model release: JA
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Close-up of Colorful Semiconductor Wafer during Microchip Packaging Process. Computer Chip Manufacturing at a Factory. Silicon Die are being Extracted by a Pick and Place Machine

Contributor: IM Imagery
ID : 2069295924

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Foto6144x3456


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Schlüsselwörter
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