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Veröffentlicht: 2026-06-25 14:08:35.503897 Kategorie: Technology Typ: Foto Model release: JA

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Close-up of Silicon Dies Attached to Substrate on During Computer Chip Manufacturing at a Fab. Microchip Production and Packaging Process at a Semiconductor Factory.

Contributor: IM Imagery

ID : 2073031272

DateienDrucke und Produkte

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Foto	6144x3456

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integrated circuit, lithography, substrate, arm, chips, component, computer, central processing unit, device, disc, electronic, equipment, fabrication, facility, factory, flash, foundry, industrial, industry, integrated, line, machine, manufacturing, memory, microchip, nanotechnology, package, cardboard box, photolithography, process, processor, production, robotic, semiconductor, shortage, silicon, technology, transistor, wafer